avatar
· Views 2,150
【英特尔发布未来芯片封装蓝图 将采用玻璃基板设计】美港电讯APP 5月19日讯,据英特尔官网消息,英特尔(INTC.O)发布了先进封装技术蓝图。在蓝图中,英特尔期望将传统基板转为更为先进的玻璃材质基板。英特尔表示,玻璃基板不仅能提高基板强度,还可以进一步降低功耗,提升能源利用率。#FXTM富拓#

Disclaimer: The views expressed are solely those of the author and do not represent the official position of Followme. Followme does not take responsibility for the accuracy, completeness, or reliability of the information provided and is not liable for any actions taken based on the content, unless explicitly stated in writing.

Reply 0

Leave Your Message Now

  • tradingContest